| |
 | |  |  |  | |  | High Performance Backplane Trends An interview with Chris Heard Teradyne Corporation |  |
|  |  | |  |
| Discuss this content or topic in the forums |
What technical challenges are there in increasing routing channels for high performance backplane?
One of the challenges that is becoming much more common is the need to back drill backplanes to ensure the highest fidelity signals can be carried at ever increasing speeds. Back drilling or controlled depth counter boring is a process where plating is removed from the unused portion of the via. I have written a paper describing a method to create all the necessary information to create files required for backdrilling using Cadence Allegro 15.x and higher.
In board to board interconnect applications what are the current trends for data rates? 3.0 Gbps is commonplace and you see data rates at 6.5 to 10 Gbps as a fast growing segment of design.
What challenges do these high speed designs bring into play? New connectors offer better impedance and shielding to accommodate faster rise times. Also laminate suppliers continue to develop new board material with lower loss tangents. Additionally, equalization circuits for signal pre-empphaiss improves signal fidelity at these higher data rates.

| |
This content has been rated 3 out of 5 by other users |
|

|
|
|
|
|
|