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Subject: Die Symbols in mutiple wirebond tiers
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DianeAPD
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4/13/2005 10:52 AM  
Hi there,

I'm using APD15.2 window version, and am working on a design where there are four wirebond tiers. Does anyone know how to create the die symbols reflecting in the four tiers? In what layer are the die symbols supposed to be generated?
SoCalDude
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4/13/2005 11:30 AM  
Just create your DIE, (DIE pads on the Wirebond Layer)
In APD you will create the Tier setup required. If you need to have a 4 Tier set up, you would do that during the Wire Bonding process.
If your DIE has one row of pins on the perimeter that counts as 1 tier, 2 rows per side..2 tiers. If you have PWR rings, those also count as tiers. You can also ADD Tiers and define as needed using the Auto Wire Bonding toolset.
DianeAPD
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4/13/2005 12:00 PM  
Thanks for the reply. Do I need to define the wirebond layers as WB1, WB2, WB3, and WB4 in the layer cross section ? Per your message, only one wirebond layer is created, and the tiers are defined under the Auto Wirebond Bonding Toolset. Pls correct me if I'm wrong.
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Forums > Silicon-package-board > PCB Design > Die Symbols in mutiple wirebond tiers


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