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Subject: Subject: Burried ,Burried micro via
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girish_mn
Posts: 17
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7/21/2008 5:49 AM  
what is meant by target pad diameter and capture pad dia in the burried and micro via
andrewsr
Posts: 13
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7/21/2008 7:31 AM  
target pad refers to the inner layer pad (the pad that the laser is targeting. makes sense). Capture pad refers to the outer layer pad.

I didn't know this either until I Googled it.
girish_mn
Posts: 17
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7/22/2008 6:02 AM  
how to define micro via & Blind/ burried viapad file in allegro ? which class we have to choose in parameter (through hole or Blin/Burried) & internal layer type(fixed /optional ) Providing the via on the pad needs thermal flash in plane ?. Pleasse help me Regards, Girish





andrewsr
Posts: 13
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7/23/2008 6:33 AM  
In Allegro go to "Setup" - "B/B Via Definitions" - "Define B/B Via", pick a name for your via, select the padstack from your library that you would like to use (it can be a thru via, it will be modified in the next step). Then select start and stop layer. Done.
girish_mn
Posts: 17
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7/23/2008 8:38 AM  
Dear andrewsr, Thank you very much , its working , for 0.4mm bga I am planing to use micro via in pad is this will create any prolrm in SJR(Solder joint) ,and for this type of whether I have to define thermal relief . Once again thaks for your suggestion Regards, Girish





cadpro2k
Posts: 45
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7/23/2008 8:44 PM  
uVia in pad design issue you've raised:

1) Solder joint rel. - No problems with uVia in pad designs I've done.
2) Thermal relief required? Absolutely not. The uVias are on plated, not solder to.

One issue I'll raise for you (since I've been doing .5 and .4mm pitch CSPs and also 250micron pitch WSP (wafer scale packaging, flip chip style). Make sure you ask for the via (in pad), within the BGA area to be "plated flat" or "cap plated and flat to the surface" or something along those lines. YOU WILL NEED THE BGA PADS FLAT TO THE SURFACE POST FABRICATION!!! (Been there, done that, and had to re-fab boards.)

Good day.
Mitch
girish_mn
Posts: 17
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7/28/2008 4:53 AM  
Hi Mitch,

Could you please tell me what is the difference b/t "Two basic types of BGA pads metal defined flat pad (MD) type BGA, and a solder mask " ,whether this to be defined during padstack design or manufacturing . I googled it but not finding clear information.

Regards,
Girish_mn
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Forums > Silicon-package-board > PCB Design > Subject: Burried ,Burried micro via


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