 | Allegro Package Designer is a complete constraint-driven physical design solution supporting all packaging methods including PGA, BGA, micro-BGA and chip scale using both flip-chip and wirebond die attach methods. Full online design-rule checking supports all combinations of laminate, ceramic and deposited substrate technologies. Multiple cavities, complex shapes, and interactive and automatic wirebonding are all supported.
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An Allegro Package Designer user for 6 years, Nathaniel Arbizu has developed various sizes of Flip-Chip Packages using Allegro Package Designer.
Nathaniel Arbizu, STATS ChipPAC Inc. | |
| | | | | |  | |  | | | | | | | | | | | | | | |  | | Allegro Package Designer 15.5 Product Review
Allegro Package Designer users for 7 years, Jeff Hall, Len Mora and Cliff Fishley have developed designs for flip chip and wirebond BGA package substrates using Allegro Package Designer.
Jeff Hall, Len Mora, Cliff Fishley, LSI Logic | |
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